DiClad 870 2-Layer 93mil PCB – High-Frequency, Low-Loss, Immersion Gold Finish for RF Applications

1.Introduction of DiClad 870

Rogers DiClad 870 laminates are woven fiberglass reinforced, PTFE-based composites designed for use as high-performance printed circuit board substrates. By utilizing fewer plies of woven fiberglass and a higher ratio of PTFE content, DiClad 870 offers a lower dielectric constant (Dk) and dissipation factor compared to other laminates in the DiClad series, making it ideal for high-frequency and low-loss applications.

2.Key Features

Dielectric Constant (Dk): 2.33 at 10 GHz and 1 MHz, 50% RH
Dissipation Factor: 0.0013 at 10 GHz, 0.0009 at 1 MHz, 50% RH
Thermal Coefficient of Dk (TcDK): -161 ppm/°C from -10°C to 140°C at 10 GHz
Arc Resistance: >180 seconds
Moisture Absorption: 0.02%
CTE: X-axis: 17 ppm/°C, Y-axis: 29 ppm/°C, Z-axis: 217 ppm/°C
Copper Peel Strength: 14 lbs/in, 10s @288°C
Flammability Rating: UL 94-V0

3.Benefits

Lowest moisture absorption among PTFE-based composites
Stable dielectric constant over a wide frequency range
Low Dk supports wider line widths for reduced insertion loss

4.PCB Construction Details

5.PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 - 35 μm
DiClad 870 - 2.362 mm (93mil)
Copper_layer_2 - 35 μm

6.PCB Statistics:

Components: 11
Total Pads: 40
Thru Hole Pads: 24
Top SMT Pads: 16
Bottom SMT Pads: 0
Vias: 19
Nets: 2

7.Typical Applications

Radar Feed Networks
Commercial Phased Array Networks
Low-Loss Base Station Antennas
Guidance Systems
Digital Radio Antennas
Filters, Couplers, LNAs

8.Quality Assurance

IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support